ESD PEEK

Overview

ESD PEEK is a carbon-filled grade of PEEK (Polyether Ether Ketone) that provides electrostatic dissipative properties while retaining the material's defining characteristics: very high continuous service temperature, broad chemical resistance, and excellent mechanical properties. Standard PEEK is already used extensively in semiconductor, aerospace, and chemical processing applications — ESD PEEK extends this into ESD-controlled zones. It is the preferred high-performance ESD material for applications where standard ESD plastics such as ESD POM or ESD UHMW cannot meet the temperature, chemical, or structural requirements. ESD PEEK is the most widely specified high-performance ESD material in semiconductor wafer handling and high-temperature electronic process equipment.

Working properties

• High continuous service temperature with ESD

  ESD PEEK maintains both structural integrity and ESD performance at significantly higher temperatures than ESD POM, ESD UHMW, or ESD MC Nylon. This enables use in heated process chambers, reflow fixtures, and high-temperature semiconductor handling equipment where standard ESD materials would soften or lose ESD performance.

• Chemical resistance

  ESD PEEK retains broad chemical resistance to most acids, solvents, and process chemicals used in semiconductor and chemical processing. The carbon filler does not significantly compromise chemical resistance for most applications.

• Mechanical properties

  ESD PEEK maintains good stiffness, tensile strength, and compressive strength. It machines to tight tolerances and produces precision components for semiconductor automation, wafer carriers, and structural ESD-sensitive fixtures.

• Consistent ESD performance

  ESD PEEK provides stable static-dissipative resistivity across the operating temperature range. The specific resistivity should be confirmed for your ESD zone classification — different grades are available for different resistivity targets.

• Machinability

  ESD PEEK machines similarly to standard PEEK. Carbide tooling and appropriate feeds produce good surface finishes and tight tolerances. It is more demanding to machine than ESD POM but can achieve finer tolerances than ESD UHMW.

Typical uses

• Semiconductor wafer carriers, end-effectors, and transport cassettes in high-temperature processes
• Precision machined ESD fixtures and brackets in semiconductor front-end and back-end equipment
• Chemical wet process components requiring both ESD control and chemical inertness
• High-temperature burn-in oven fixtures and carrier trays in electronics manufacturing
• Aerospace and defence ESD-sensitive structural components at elevated temperatures

Things to confirm before ordering

• Resistivity class — confirm required surface and volume resistivity range for your ESD zone classification.
• Grade — unfilled ESD, glass-filled ESD PEEK; the base grade affects stiffness, thermal expansion, and other properties.
• Temperature range — confirm the maximum continuous and peak temperatures the component will experience.
• Chemical exposure — confirm specific process chemicals and temperatures; while ESD PEEK has broad resistance, verify compatibility for your specific environment.

How does ESD PEEK compare?

• ESD POM

  ESD POM is significantly lower cost and appropriate for ambient-to-moderate temperature ESD applications. When temperature, chemical resistance, or structural performance requirements exceed ESD POM's capability, ESD PEEK is the appropriate upgrade.

• ESD Ultem →

  ESD Ultem offers inherent flame resistance without halogenated additives — useful in aerospace. ESD PEEK has higher maximum service temperature and generally better chemical resistance. The choice depends on whether flame resistance or temperature/chemical performance is the priority.